A method and an apparatus is provided for removing wafer processing by-products (145) from gas fluid exhaust systems utilizing an energy source (255) placed within an exhaust channel (207) either alone or in combination with a cleaning gas (230). The placement of the energy source in an exhaust channel enables emitted energy to react with wafer processing by-products to convert the by-product residues to more removable forms. Additionally provided is a cleaning gas source (230) internal to the exhaust channel to further react with and convert exiting by-product residues to gaseous fluids.
