发明名称 Radiation emitting semiconductor body, especially an LED chip, has an electrically conductive radiation output layer of indium-gallium-aluminum phosphide
摘要 A radiation emitting semiconductor body, having an electrically conductive radiation output layer (5) of indium-gallium-aluminum phosphide, is new. A radiation emitting semiconductor body has an InGaAlP active layer (3) followed, in the main emission direction (8), by an electrically conductive radiation output layer (5) of InxGa1-x-yAlyP, where x = greater than 0 to 0.10 and y = 0 to 0.10 exclusive. An Independent claim is also included for production of the above semiconductor body, in which the process temperature is altered continuously or in steps during growth of the radiation output layer.
申请公布号 DE19844985(A1) 申请公布日期 2000.04.13
申请号 DE19981044985 申请日期 1998.09.30
申请人 SIEMENS AG 发明人 HAMPEL, MARK;STATH, NORBERT
分类号 H01L33/02;H01L33/30;(IPC1-7):H01L33/00 主分类号 H01L33/02
代理机构 代理人
主权项
地址