发明名称 METHODS AND APPARATUS FOR HERMETICALLY SEALING ELECTRONIC PACKAGES
摘要 <p>An electronic package and/or package lid includes at least one connection slot for receiving a line, such as an optical fiber. The package and/or package lid also includes at least one sealant slot proximate the connection slot. Optical fibers are connected to a component, such as an opto-electronic component, through the connection slot. A sealant provided via the sealant slot hermetically seals the optical fibres within the connection slot.</p>
申请公布号 WO2000021130(A1) 申请公布日期 2000.04.13
申请号 US1999022606 申请日期 1999.09.29
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