Composition for preparing insulating materials used as raw materials for build-up print circuit boards, includes epoxy resin, curing agent and poly(ether sulfone)

摘要

The composition includes an epoxy resin having two or more glycidyl groups, a curing agent and a poly(ether sulfone). A thermosetting resin composition, for a build-up method, comprises: (A) an epoxy resin having two or more glycidyl groups; (B) a curing agent for epoxy resin; (C) a poly(ether sulfone); and (D) optionally an inorganic filler. Independent claims are also included for: (1) an insulating material for a build-up method which has a resin-containing layer formed by curing a composition as above; and (2) a build-up printed circuit board formed by using an insulating material as above.