SUBSTRATE PLATING DEVICE

摘要

A substrate plating device which can form a plating layer on a sheet surface and store the substrate without being exposed to the atmosphere until the next process. A substrate plating device which can continuously introduce, one by one, for processing semiconductor wafers not housed in a cassette into the plating device, can minimize particle contamination and oxide film formation and can reduce an installation area by decreasing the number of processes. The substrate plating device comprises a plating unit (20) for plating a substrate and a cleaning unit (10) for cleaning the plated substrate, the device being further provided with a substrate storing tank (16) for immersing in a storing liquid the plated and cleaned substrate for storing. A substrate carrying machine provided in the substrate plating device can perform at least one of the carrying-in and carrying-out of a substrate into/from the plating device so that unplated substrates can be carried into the plating device one by one and plated and cleaned substrates can be carried out therefrom one by one.