Soldering of low melting point highly conductive thin sheet components, especially stud soldering to a sheet, is effected using a solder deposit of low melting solder and high electrical resistance high melting solder

摘要

Soldering of low melting point, highly conductive thin sheet components (1,2), using a solder deposit of low melting solder and high electrical resistance high melting solder, is new. Thin sheet components are soldered, according to the parent patent application DE19714755.0, by depositing a solder powder on one of the components by means of solder sintering using conductive resistance heating preferably at the particle surfaces, positioning the components so that the solder deposit is located between the components and then locally heating and cooling the assembly between electrodes. In the present invention, the thin sheet components are soldered together by loosely placing a low melting solder powder, mixed with 30-70 % of a high melting solder with a high electrical resistance and a particle size of less than 30 microns , on one of the components or on a lower electrode prior to carrying out the process of the parent patent.