发明名称 Method for attaching an acoustic transducer to a substrate
摘要 <p>The invention relates to a method in connection with an acoustic transducer, such as a microphone (1), for a communication device, such as a wireless communication device (4), in which method the acoustic transducer (1) is attached on a substrate (2), such as a circuit board, or integrated in the substrate (2), and the housing (5) of the communication device is formed of at least a first (5a) and a second part (5b). The substrate (2) is provided with one or more apertures (3a-3f), which partly surround the acoustic transducer (1) order to achieve a nearly floating attachment for the acoustic transducer (1). &lt;IMAGE&gt;</p>
申请公布号 EP0992973(A2) 申请公布日期 2000.04.12
申请号 EP19990660157 申请日期 1999.10.05
申请人 NOKIA CORPORATION 发明人 HIETANEN, JARMO
分类号 H04M1/03;H04R1/02;G10K11/00;H04M1/02;H04R19/04;H05K1/02;(IPC1-7):G10K11/00 主分类号 H04M1/03
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