Method for bonding bumped electronic components to a substrate

摘要

There is disclosed herein a method for bonding an electronic component 10 having bump terminations 14 on a surface thereof to a dielectric substrate 20 having a plurality of copper mounting pads 22, comprising the steps of: (a) providing the component 10 and the substrate 20; (b) depositing a layer of silver 30 atop each copper mounting pad 22, thereby forming a plurality of silvered pads 40; (c) positioning the component atop the substrate such that each bump termination 14 is registered atop a respective one of the silvered pads 40; and (d) bonding the bump terminations to their respective silvered pads by solid-to-solid diffusion bonding, such as by thermocompression bonding.