| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the breakage and contamination of a wafer by preventing the attachment and fixing of contamination at a holding part in the wafer- carrier device, which is mounted on a polishing device and the like of the semiconductor wafer and the like, sucks and holds the wafer at a holding part comprising a porous member and the like and carries the wafer. SOLUTION: This device has a vacuum source 43, which applies sucking action to a holding part, a mixing part 44, wherein air and water are mixed, an air supply source part 46, which supplies air into the mixing part 44, and a water-supply source 45, which supplies the water into the mixing part 44. Then, the vacuum source 44 is connected to the holding part through a first opening/closing means 41. The air supply source 46 and the water supply source 45 are connected to the mixing part 44. The mixing part 44 constitutes the wafer-carrier device, which is connected to the holding part through a second opening/closing means 42. When the wafer is opened, the bubbles wherein the water and the air are mixed, are blown out.</p> |
