| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper conductor paste capable of lowering running costs in processes by shortening a firing time period in a nitrogen atmosphere, improving adhesion between a substrate and a fired film and maintaining thermal cycling, thermal shock, thermal aging and constant temperature/humidity characteristics. SOLUTION: This copper conductor paste is obtained by adding mixed copper powder of main base copper powder with an average particle size in the range from 0.5 to 10μm and at least one type of subsidiary copper powder with an average particle size in a smaller range, binder resin, glass powder and organic solvent into fine copper powder with an average particle size in the range from 1 to 200 nm consisting of copper, copper oxide or these mixture. Glass powder containing at least two types of glass components, SiO2-B2O3-ZnO based and SiO2-B2O3-Bi2O3 based, with a softening point of 500-600 degrees C is used 0.5-47 wt.% of a total amount of the fine copper powder and the mixed copper powder.
|
