| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing material and a sealed structure using the sealing material, affording a highly electroconductive sealing layer. SOLUTION: This electroconductive sealing material comprises refractory filler particles 4 and electroconductive powder 1; wherein the size of each of the refractory filler particles is the average thickness of the sealing layer afforded by this material or smaller, the size of each particle of the electroconductive powder is 0.9 to 1.0 time the average thickness of the sealing layer, and the content of the electroconductive powder in this sealing material is 3-50 vol.%. The other objective sealed structure is such one that the electroconductive powder particles 1 in the sealing layer sandwiched between two sealed members 5 and 6 are in contact with the two sealed members 5, 6.
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