| 摘要 |
PROBLEM TO BE SOLVED: To increase the adhesive strength between a metal and a polymeric material by bringing the metal surface into contact with an adhesion promoting composition consisting of an oxidizing agent, an acid and a corrosion inhibitor, further a halide ion source, if necessary, and a water-soluble polymer, as required, and then with an alkaline soln. SOLUTION: The surface of copper is suitably treated with an acidic peroxide adhesion promoting composition and then with alkaline treatment. A minute coarse chemical conversion applied surface is formed on the metal by the composition, the adhesiveness of the formed surface is remarkably increased as compared with an untreated metal surface, and hence the surface is appropriately combined with a polymeric material. Further, the increased adhesion is kept on the applied surface over a long period, and the possibility that an undesirable reaction takes place between the metal and material is reduced over a long period. By such a treatment, the intermediate layer is combined with a prepreg or a picture formable dielectric, for example, to form a multilayer printed circuit board.
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