| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor device attaining miniaturization and light weighting. SOLUTION: A semiconductor device contains the first and second semiconductor elements 4, 6 whose opposite sheet faces are electrically insulated to be laminated, a film 8 made of insulating material extended between the first and second semiconductor elements 4, 6 interposed between the first an second semiconductor elements 4, 6 on both sides of the same 4, 6 as well as the first and second circuit patterns 10, 12. Besides, the first and second circuit patterns 10, 12 are in contact with the pumps 14 arranged on the upperside and lowerside of the first and second semiconductor elements 4, 6 on the position wherein the film 8 is interposed between the first and second semiconductor elements 4, 6 to be electrically connected. Furthermore, the end parts on the opposite side to the semiconductor elements 4, 6 of the first and second circuit patterns 10, 12 are protruded from the end parts of respective film 8. |
