Method of forming a metal line utilizing electroplating

摘要

The invention relates to a method of forming a metal line. A photoresist layer is formed on a substrate and patterned so that a metal part on the substrate is exposed. A metal seed layer is then deposited over the photoresist layer utilizing a directional deposition technique. A portion of the metal seed layer is then removed. A metal plating is then formed on the metal seed layer utilizing a technique selected from the group consisting of electroplating and electroless plating. The photoresist layer is then removed.