| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat radiation by simplifying the constitution in relation to a lead-on-chip(LOC) semiconductor device. SOLUTION: In a semiconductor device provided with a lead 12 having electrically connected inner lead part 14 and externally connected outer lead part 15 as well as a resin package 13 sealing the semiconductor chip 12, a heat radiating lead part 25A structured of the same lead frame and thermally connected to the semiconductor chip 12 is provided. |
