| 摘要 |
An apparatus for providing heat dissipation and electromagnetic shielding for an integrated circuit, such as a CPU, in a computer system includes a first surface thermally coupling the apparatus to an integrated circuit (IC). The apparatus, including the first surface, is of a material, such as some alloys of beryllium copper, with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin). The material is electrically conductive.
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