发明名称 |
Electronic device with high wettability solder pads |
摘要 |
An electronic device has a layer of high wettability tin-bismuth solder alloy on component leads and substrate pads. The solder is electrodeposited onto copper with an electrodeposition bath containing a zinc salt, although no zinc is co-deposited on the copper. The tin-bismuth layer has a low quantity of oxygen thereby increasing the wettability and decreasing the oxidation at the surface after reflowing.
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申请公布号 |
US6048629(A) |
申请公布日期 |
2000.04.11 |
申请号 |
US19980118482 |
申请日期 |
1998.07.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAVALLOTI, PIETRO LUIGI;SIRTORI, VITTORIO;ZANGARI, GIOVANNI |
分类号 |
B23K35/26;C25D3/56;C25D3/60;H05K3/24;H05K3/34;(IPC1-7):B32B15/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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