| 摘要 |
PROBLEM TO BE SOLVED: To provide the method for efficiently manufacturing a semiconductor device, the semiconductor device manufactured by the method thereof, the tape carrier and manufacture thereof used in the method thereof, a circuit board, electronic devices and a tape-carrier device. SOLUTION: The following porcesses are included. A carrier tape 10 has a recognizing mark 22, which regularly and repeatedly marks a matrix 13 of bonding parts 14 in a plurality of rows and in a plurality of columns so that the bonding parts 14 are aligned in a plurality of lines in the width direction in the first process. In the next process, the tape carrier 10 is inspected. In the next process, the defective part of the tape carrier 10 detected in the inspecting process is cut and removed, and the tape carrier 10 is connected under the state, wherein the regular repetition of the matrix 13 is maintained. In the next process, a connecting mark 21, which marks the matrix 13 where the connecting part 21 is formed and located at the connecting process, is located. |
