| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device housing package which is improved in optical signal transmission efficiency by a method wherein light stimulated in an optical semiconductor device is effectively transmitted through an optical fiber through the intermediary of a light transmitting member. SOLUTION: An optical semiconductor device housing package is composed of a base 1 equipped with a mount 1a mounted with an optical semiconductor element 4 on its top surface, a frame 2 mounted on the base 1 surrounding the mount 1a and provided with a through-hole 2a bored in its side, a cylindrical stationary member 9 mounted on the frame 2 surrounding the through-hole 2a provided to the frame 2 and provided with an inner space through which light signals are transmitted, a light transmitting member 10 that is mounted inside the cylindrical stationary member 9 to stop up the inner hole of the stationary member 10, and a lid material 3 mounted on the top surface of the frame 2 hermetically sealing up the optical semiconductor element 4, wherein the light transmitting member 10 is mounted on the stationary member 9 through the intermediary of an adhesive agent 12 whose Young's modulus of elasticity is 3GPa or below. |
