发明名称 MODIFIED CYANATE ESTER RESIN FOR PRINTED WIRING BOARD AND PRODUCTION OF PREPREG AND METAL CLAD LAMINATE BOARD EMPLOYING IT
摘要 PROBLEM TO BE SOLVED: To enhance heat resistance of resin varnish by making the vanish contain a cyanate ester compound, a monovalent phenol compound, dicyclopentadiene resin, a flame retardant, a metal based reaction catalyst, an aromatic hydrocarbon based solvent and a ketone based solvent as inevitable components. SOLUTION: The modified cyanate ester resin varnish for printed wiring board contains, as inevitable components, a cyanate ester compound shown by formula I, a monovalent phenol compound shown by formula III dicyclopentadiene resin, a flame retardant exhibiting no reactivity to cyanate ester compound, a metal based reaction catalyst, an aromatic hydrocarbon based solvent arid a ketone based solvent. In the formula I, R1 is shown by formula II, R2 and R3 represent a hydrogen or methyl group. In formula III, R4 and R5 represent a hydrogen atom or a lower alkyl group of 1-4C and n represents a positive integer of 1-2.
申请公布号 JP2000106476(A) 申请公布日期 2000.04.11
申请号 JP19980274430 申请日期 1998.09.29
申请人 HITACHI CHEM CO LTD 发明人 NEGISHI HARUMI;SUGIMURA TAKESHI
分类号 H05K1/03;C08J5/24;C08K5/02;C08K5/3477;C08L45/00;C08L65/00;C08L79/00;C09D4/06;(IPC1-7):H05K1/03;C08K5/347 主分类号 H05K1/03
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