| 摘要 |
PROBLEM TO BE SOLVED: To provide a method a bonding a surface-mount part to a printed board without conducting the stress imposed on the printed board to a soldered joint or a chip. SOLUTION: Pads 12 are provided to a printed board 11 on the outer extensions of terminals of a chip 15, solder paste 13 is applied onto the printed board 11 at positions corresponding to the terminals of the chip 15, thin film metal conductors 14 are provided thereon, and furthermore the chip 15 is mounted thereon. By heating, a part of the thin film metal conductor 14 and the pad 12 are soldered together, and the terminal of the chip 15 and a part around a small hole 19 of the thin film metal conductor 14 are soldered together. Stress caused by the deflection of the printed board 11 is absorbed by the thin film metal conductor 14 and restrained from being conducted to a chip terminal joint and the chip 15 itself.
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