发明名称 |
LAYOUT METHOD AND DEVICE OF SEMICONDUCTOR LASER DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for accurately laying out a laser device. SOLUTION: The cleavage plane 1a of a semiconductor laser device 1 held by a nozzle 2 is irradiated with laser beams L1 and L2 and laser beams reflected from the cleavage plane 1a are received by a photodetector 5. Data on the deviation of the semiconductor laser device 1 from a prescribed position are compiled on the basis of the output of the photodetector, and the nozzle 2 is driven based on the compiled data to arrange the semiconductor laser device 1 at a prescribed position.
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申请公布号 |
JP2000106467(A) |
申请公布日期 |
2000.04.11 |
申请号 |
JP19980273526 |
申请日期 |
1998.09.28 |
申请人 |
SANYO ELECTRIC CO LTD;TOTTORI SANYO ELECTRIC CO LTD |
发明人 |
ISHII TOSHIHIKO |
分类号 |
H01S5/00;H01S5/022;(IPC1-7):H01S5/022 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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