发明名称 LAYOUT METHOD AND DEVICE OF SEMICONDUCTOR LASER DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for accurately laying out a laser device. SOLUTION: The cleavage plane 1a of a semiconductor laser device 1 held by a nozzle 2 is irradiated with laser beams L1 and L2 and laser beams reflected from the cleavage plane 1a are received by a photodetector 5. Data on the deviation of the semiconductor laser device 1 from a prescribed position are compiled on the basis of the output of the photodetector, and the nozzle 2 is driven based on the compiled data to arrange the semiconductor laser device 1 at a prescribed position.
申请公布号 JP2000106467(A) 申请公布日期 2000.04.11
申请号 JP19980273526 申请日期 1998.09.28
申请人 SANYO ELECTRIC CO LTD;TOTTORI SANYO ELECTRIC CO LTD 发明人 ISHII TOSHIHIKO
分类号 H01S5/00;H01S5/022;(IPC1-7):H01S5/022 主分类号 H01S5/00
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