发明名称 |
BAND BUNDLING MACHINE AND METHOD FOR CONTROLLING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a band bundling machine wherein a good bundling can be achieved even if a soft work or a work which is easy to break is bundled. SOLUTION: There are provided a band pay-out mechanism 3 to pay out a band 1 along a guide route 2, a band tightening mechanism 4 which pulls back the band 1 to wind it around a work 36, and a band joining mechanism 5 to thermally bond a stacked portion of the band 1. A band drive roller 41 which can be driven normally and reversely to pay out or pull back the band 1 and a driven roller 43 which is pressed by the roller 41 are provided. A set input part 46 is provided to set a bundling length around the work 36 at a locating where the band 1 is wound. A servomotor 44 is provided with encoder to normally and reversely drive the roller 41. A control part 45 is provided to control the pulled back amount of the paid out band 1 based on the amount of rotational drive of the servomotor 44 corresponding to a bundle length set in the input part 46.
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申请公布号 |
JP2000103407(A) |
申请公布日期 |
2000.04.11 |
申请号 |
JP19980277534 |
申请日期 |
1998.09.30 |
申请人 |
SHIN MEIWA IND CO LTD |
发明人 |
SHIMADA MINORU;HASEGAWA SHUJI |
分类号 |
B65B13/22;(IPC1-7):B65B13/22 |
主分类号 |
B65B13/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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