发明名称 FINE RESIST PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To attain high sensitivity while maintaining a high rate of a residual film and to form a good pattern with high resolving power by developing a specified positive type photoresist composition with a specified developer. SOLUTION: A positive type photoresist composition containing 3-15 pts.wt. sensitizer containing a quinonediazido group based on 100 pts.wt. alkali-soluble novolak resin is developed with an aqueous organic or inorganic alkali solution having a lower concentration than the conventional solution as a developer. This developer is, e.g. an aqueous solution of a quaternary ammonium hydroxide of the formula [(R1)3N-R2]+OH- (where R1 is 1-3C alkyl or 1-3C hydroxy substituted alkyl) having <=2.2 wt.% concentration. The quaternary ammonium compound is, e.g. tetramethylammonium hydroxide or tetraethylammonium hydroxide.
申请公布号 JP2000105466(A) 申请公布日期 2000.04.11
申请号 JP19980275933 申请日期 1998.09.29
申请人 CLARIANT (JAPAN) KK 发明人 IGAWA AKIHIKO;IKEMOTO JUN
分类号 H01L21/027;G03F7/022;G03F7/023;G03F7/32 主分类号 H01L21/027
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