| 摘要 |
A semiconductor device and method to control generation of a void within resin during supply to an area between a semiconductor chip and a substrate body. The substrate body includes a wiring layer which is connected to an external bump through internal wiring. Solder resist is formed on the substrate body and an aperture in the solder resist exposes a plurality of pads to electrically connect with the semiconductor chip. During loading of the semiconductor chip, the resin is supplied to the aperture. The aperture is formed in a circumferential shape to control generation of the void.
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