| 摘要 |
PROBLEM TO BE SOLVED: To improve thermal fatigue of a solder ball and heighten jointability. SOLUTION: This solder ball includes any one of Pb, Sn, or In as a main component, and at least 0.1-2.0 wt.% Fe is added as additive components, and projection failure is removed from the surface. A Fe base alloy is melted at the temperature 200-1,000 deg.C higher than the liquid phase line temperature, and is rapidly cooled. Also, when a solder ingot is manufactured using the base alloy, the alloy is melted at the temperature 200-1,300 deg.C higher than the liquid phase line temperature and is rapidly cooled.
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