METHOD AND DEVICE FOR PROCESSING OBJECT

摘要

PROBLEM TO BE SOLVED: To suppress particles from being generated in a reaction tube and to manufacture a high-quality semiconductor device at high yield. SOLUTION: A sub-bypass pipe 65 equipped with a sub-valve SSV is formed parallel to a slow-exhaust bypass pipe 64 of an evacuation system of a thermal process apparatus. While the sub-valve SSV is opened to evacuation through the sub-bypass pipe 65, a wafer boat 14 is loaded or unloaded from a reaction pipe 11, and sticking of sublimation gas which is a reaction by-product and particles to a semiconductor substrate 15 are prevented.