| 摘要 |
A cross flow fan cooling device for semiconductor components includes a heat sink and a cross flow fan. The heat sink has a plurality of fins and two mounting slots on two most outside fins. The cross flow fan has a back of fan housing, a fan left end and a fan right end to be assembled into the fan housing. The fan left end has a hole for setting rubber boot which holds a bearing. The bearing is as one side supporter for the blade rotor. A motor is inserted into the fan right end. A shaft of the motor is used as other side supporter for the blade rotor. Both the fan left end and the fan right end have slots, which match slots on the heat sink, for mounting the cross flow fan to the heat sink.
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