| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste composition capable of joining a semiconductor element to a substrate member by curing within 20 seconds and, at the same time, capable of reducing voids in the adhesive layer, and a semiconductor device using this composition which is high in productivity and reliability. SOLUTION: A resin paste composition comprises an unsaturated compound having a carboxyl group in the molecule, an acrylate ester compound or a methacrylate compound, a radical initiator, an epoxy resin, an epoxy resin curing agent, and a filler. A semiconductor device is obtained by joining a semiconductor element to a substrate member with use of this resin paste composition. |
