| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspecting semiconductor device which causes no difference in voltage applied to a semiconductor device to be inspected regardless of the installation position on a grounding plate of the semiconductor device to be inspected. SOLUTION: In this inspecting device, taking simultaneous measurement number which causes no difference in voltage applied to a semiconductor device to be inspected depending on the distance to a high-accuracy grounding HGND as a reference in making simultaneous measurement, n-sets (n: positive integers equal to or larger than 1) of a semiconductor socket and a semiconductor measuring set including a socket board 14 and a grounding plate 12 are provided corresponding to the reference simultaneous measurement number, individual driving sources 3 are assigned to the grounding plates of the semiconductor measurement sets, and individually a high-accuracy grounding HGND is set on only one portion.
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