发明名称 FILM-LIKE SEALING AGENT FOR ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To obtain a film-like sealing agent for an electronic part, capable of enabling a successive sealing work without requiring an expensive apparatus because of the excellent processability, therefor hardly causing the cost rise, capable of providing excellent heat resistance and electrical insulating properties after sealing. SOLUTION: This film-like sealing agent for an electronic part is composed of a polycarbodiimide resin and an epoxy resin. The polycarbodiimide resin has 3,000-50,000 number-average molecular weight expressed in terms of polystyrene and measured by a gel-permeation chromatography, and contains 20-150 pts.wt. epoxy resin based on 100 pts.wt. polycarbodiimide resin, or comprises the polycarbodiimide resin, the epoxy resin, and a coloring agent. The polycarbodiimide resin has 3,000-50,000 number-average molecular weight expressed in terms of the polystyrene and measured by the gel-permeation chromatography. The sealing agent contains 20-150 pts.wt. epoxy resin based on 100 pts.wt. polycarbodiimide resin.
申请公布号 JP2000103962(A) 申请公布日期 2000.04.11
申请号 JP19980277438 申请日期 1998.09.30
申请人 NISSHINBO IND INC 发明人 IMASHIRO YASUO;ITO TAKAHIKO;TOMITA HIDEJI;NAKAMURA NORIMASA
分类号 C08L63/00;C08J5/18;C08L79/00;C08L79/08;H01L23/29;H01L23/31;(IPC1-7):C08L79/08 主分类号 C08L63/00
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