发明名称 |
Radiation sensitive resin composition |
摘要 |
A radiation sensitive resin composition comprising an alkali-soluble resin such as a polyvinyl phenol or a phenol resin other than a polyvinyl phenol having a weight average molecular weight of 2,000 or higher, a cross-linking agent such as an amino resin having two or more active methylol groups in a molecule, a particulate rubbery material comprising a cross-linked polymer chemically modified with an epoxy compound, a liquid rubbery material having a number average molecular weight between 1,000 and 10,000 and a glass transition temperature of -20 DEG C. or lower, and a radiation polymerization initiator. The composition is best suited for use as a material for preparing an insulating layer interposed between two layers of conductive wiring that are arranged in an overlaying stack.
|
申请公布号 |
US6048666(A) |
申请公布日期 |
2000.04.11 |
申请号 |
US19980089501 |
申请日期 |
1998.06.03 |
申请人 |
JSR CORPORATION |
发明人 |
NIWA, KAZUAKI;SUZUKI, MASAKO;OTA, TOSHIYUKI;SATO, HOZUMI;CHIBA, HIDEKI |
分类号 |
G03F7/004;C08L61/10;C08L61/28;G03F7/027;G03F7/032;G03F7/038;H05K3/46;(IPC1-7):G03F7/038;G03F7/16;G03F7/40 |
主分类号 |
G03F7/004 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|