发明名称 Radiation sensitive resin composition
摘要 A radiation sensitive resin composition comprising an alkali-soluble resin such as a polyvinyl phenol or a phenol resin other than a polyvinyl phenol having a weight average molecular weight of 2,000 or higher, a cross-linking agent such as an amino resin having two or more active methylol groups in a molecule, a particulate rubbery material comprising a cross-linked polymer chemically modified with an epoxy compound, a liquid rubbery material having a number average molecular weight between 1,000 and 10,000 and a glass transition temperature of -20 DEG C. or lower, and a radiation polymerization initiator. The composition is best suited for use as a material for preparing an insulating layer interposed between two layers of conductive wiring that are arranged in an overlaying stack.
申请公布号 US6048666(A) 申请公布日期 2000.04.11
申请号 US19980089501 申请日期 1998.06.03
申请人 JSR CORPORATION 发明人 NIWA, KAZUAKI;SUZUKI, MASAKO;OTA, TOSHIYUKI;SATO, HOZUMI;CHIBA, HIDEKI
分类号 G03F7/004;C08L61/10;C08L61/28;G03F7/027;G03F7/032;G03F7/038;H05K3/46;(IPC1-7):G03F7/038;G03F7/16;G03F7/40 主分类号 G03F7/004
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