发明名称 SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To improve light-receiving efficiency by a CCD solid-state image pickup device of a frame transmission system. SOLUTION: A protective film 11 consisting of a light-transmitting resin is formed on a silicon substrate 11 formed with isolation regions 3 and a diffused layer 4, which is used as a channel region, and V-shaped grooves 12 extended along the regions 3 are formed in the surface of this protective film 11. Light, which irradiates the parts of the grooves 12 over the regions 3, is refracted on the slant surfaces within the grooves 12 and is led to the interior of the channel region. As the light, which irradiates the regions 3 (the regions where are not made a photoelectric conversion), is refracted within the film 11 so as to turn to the sides of photoelectric conversion regions adjacent to each other, most of the light, which enters the light-receiving surface of a solid- state image sensing device, is utilized for photoelectric conversion.
申请公布号 JP2000106425(A) 申请公布日期 2000.04.11
申请号 JP19980273545 申请日期 1998.09.28
申请人 SANYO ELECTRIC CO LTD 发明人 HAMADA MINORU
分类号 H01L27/14;H01L27/148;H04N5/335;H04N5/3725;(IPC1-7):H01L27/14 主分类号 H01L27/14
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