PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND METALLIC COVER BODY USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a package for housing an electronic component capable of effectively avoiding the corrosion of a brazing filler metal or a metallic cover body due to atmospheric moisture by junctioning a metallized layer of an insulating base substance and a metallic cover body without making a gap between them also melting down the brazing filler metal in wider width than the irradiating width with electron beams even if the upper side of the metallic cover body is irradiated with the electron beams in a small diameter. SOLUTION: In an electronic component package composed of an insulating base substance 1 having a mounting part 1a mounted with an electronic component 3 in the upperside thereof and a frame type metallized layer 5 coated as if encircling the loading part 1a as well as a metallic cover body 2 junctioned with the metallized layer 5 of the insulating base substance 1 by electron beam welding process through the intermediary of a brazing filler metal 6 for airtightly sealing the electronic component 3 between the insulating base substance 1, both sides of a core material 2a made of iron-nickel alloy sheet or ron-nickel-cobalt alloy sheet are coated with nickel layer 2b also the total thickness of the nickel layers 2b is to be 10-50% of the thickness of the metallic cover body 2.