| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-fixing tape for a lead frame capable of prohibiting by heating and of reducing the migration of copper outgasing used in a lead frame, and a semiconductor device using this lead-fixing tape. SOLUTION: A lead-fixing tape for a lead frame can be obtained by coating a heat-curable adhesive comprising not less than 60 wt.% imide type resin and not more than 40 wt.% sum of an acetonitrile butadiene rubber and a phenolic resin and, simultaneously, not more than 10 wt.% acetonitrile butadiene rubber or not more than 20 wt.% phenolic resin on a thermoplastic insulating film.
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