| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preparing multi-layer printed wiring boards excellent in heat resistance, formability and surface smoothness without using an undercoating agent and with high productivity as well. SOLUTION: An inter layer insulation adhesive for a multi-layer printed wiring board comprises, as essential components, (a) an epoxy resin having an epoxy equivalent weight of not more than 500, (b) an epoxy resin curing agent, (c) a diluent composed of a monomer having a plurality of photo- functional groups and/or a polyfunctional monomer having a photo-functional group and a heat-functional group, (d) a photopolymerization initiator, and (e) an inorganic filler. An insulation adhesive film is obtained by coating this insulation adhesive on a carrier film. A method for preparing a multi-layer printed wiring board comprises the steps of laminating this insulation adhesive film on an inner circuit substrate; irradiating the laminated adhesive film with activation energy rays; and heat-curing the resulting film. |
