| 摘要 |
PROBLEM TO BE SOLVED: To simplify the bonding process of a shield case by mounting an electronic part such that the earth potential terminal electrode thereof comes on the outer circumferential side and bonding a shield case conductively with the earth potential terminal electrode of the electronic part. SOLUTION: An electronic part 4 is bonded onto a wiring pattern through solder S such that the earth potential terminal electrode 4a thereof comes on the outer circumferential side and the inner wall face of a shield case 3 is partially brought into contact with the outer end face of the earth potential terminal electrode 4a. The electronic parts 4 are arranged at two corner parts on the diagonal of a board 1 while directing the earth potential terminal electrode 4a of a plurality of electronic parts 4 toward the side of two boards 1 constituting the corner part thus simplifying the bonding process of shield case 3.
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