发明名称 Protection circuit for a semiconductor device
摘要 A semiconductor device having a substrate with a first conductivity type. The substrate has a top substrate region that also has the first conductivity type. A first doped region, a second doped region and a third doped region are located in the top substrate region where the first and second doped regions have a second conductivity type opposite the first conductivity type while the third doped region has the first conductivity type and where the third doped region is between the first and second doped regions. A doped well region is also in the top substrate region and has the second conductivity type and has the second doped region and at least a portion of the third doped region located therein. A method of forming the device is also provided herein.
申请公布号 US6049119(A) 申请公布日期 2000.04.11
申请号 US19980071323 申请日期 1998.05.01
申请人 MOTOROLA, INC. 发明人 SMITH, JEREMY C.
分类号 H01L29/73;H01L21/331;H01L21/822;H01L21/8234;H01L21/8249;H01L23/12;H01L27/02;H01L27/04;H01L27/06;H01L27/088;H01L29/732;(IPC1-7):H01L27/082;H01L27/102;H01L29/00;H01L29/70 主分类号 H01L29/73
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