| 摘要 |
A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure is applied to the conductive adhesive by a nonconducting adhesive that is first cured between oppositely facing nonconductive surface areas of the component and substrate. This fixes the thickness of each layer of the conductive adhesive at a dimension no greater than its design conductive thickness. In a first submethod, the nonconducting adhesive is a fast setting adhesive subjected to mechanical pressure only as it is assembled on the substrate prior to the subsequent curing of the conductive adhesive. In a second submethod, it is a high shrinkage adhesive that applies compressive force between the component and substrate as it cures and shrinks dimensionally while at a temperature below the subsequent curing temperature of the conductive adhesive.
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