| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a bonding structure by ultrasonic excitation capable of obtaining a certain welded surface even with respect to a part having difference in level by one ultrasonic irradiation. SOLUTION: Both side wall surfaces 15A, 15A of the bonding recessed part of a chip main body 11 are formed as taper surfaces and both side wall surfaces 17C, 17C of bonding projected part 17 of the lid member 12 fitted in the bonding recessed part 15 are also formed as taper surfaces. When ultrasonic excitation is performed in an amplitude direction A in such a state that the chip main body 11 and the lid member 12 are assembled, the bonding surfaces of the side wall surfaces 15A and the side wall surfaces generate friction heat by ultrasonic waves because they have projection area in the amplitude direction A to be welded mutually. By this constitution, the whole to be bonded can be welded by once applying ultrasonic excitation to a part having difference in level.</p> |
