发明名称 POLYPHENYLENE SULFIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a polyphenylene sulfide resin composition enabling burr to be decreased, and useful for various kinds of electric and electronic parts, especially small precision parts or the like by adding a specific amount of a colloidal silica to a polyphenylene sulfide resin. SOLUTION: This polyphenylene sulfide resin composition is obtained by adding (B) a colloidal silica to (A) a polyphenylene sulfide resin. Preferably, the amount of the added component B is 0.0005-0.5 pts.wt. expressed in terms of silica based on 100 pts.wt. component A, and the particle diameter of the silica in the component B is 1-60 nm. Especially, the silica is the one having a string-like shape with 1-60 nm thickness and 10-500 nm length. The composition preferably contains (C) 0.05-5 pts.wt. alkoxysilane compound having a functional group such as an epoxy group based on 100 pts.wt. component A.
申请公布号 JP2000103963(A) 申请公布日期 2000.04.11
申请号 JP19980276102 申请日期 1998.09.29
申请人 TORAY IND INC 发明人 KOBAYASHI SADAYUKI;ISHIO ATSUSHI;KOBAYASHI KAZUHIKO
分类号 B29C45/00;B29K81/00;C08K3/36;C08K5/54;C08L81/02;(IPC1-7):C08L81/02 主分类号 B29C45/00
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