| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in mold release property, remarkably little in stain of mold and stain of the surface on molded article, excellent in continuous moldability and useful for semiconductor devices, or the like, by including a specific organopolysiloxane. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) a mold release agent and further (F) an organopolysiloxane represented by the formula (X is a polyether group; Y is an alkoxy group; z is epoxy group, amino group, hydroxyl group or the like; (l), (m), (n) and (o) are each an arbitrary integer of >=1), preferably in an amount of 0.05-1.5 wt.% based on total composition. Furthermore, it is preferable that the component D is previously surface-treated with the component F and the component C is an organic phosphine and the component B is a phenol novolak resin in which its binuclear amount is >=10% and ortho-cresol novolak epoxy resin in which its binuclear amount is <=10% is used as the component A.
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