发明名称 EPOXY RESIN MOLDING MATERIAL FOR SEALING AND DEVICE FOR ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material excellent in dehalogenation, deantimonation and high-temperature releasing characteristics and useful as an electronic device, or the like, by compounding an epoxy resin with a specific cyclic phosphazene as a flame retardant. SOLUTION: This epoxy resin molding material consists essentially of (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxyl groups in one molecule, (C) a cyclic phosphazene compound containing formula I and/or formula II [(m) and (n) are each 1-10; R1 to R4 and R5 to R8 are each a (substituted) 1-12C alkyl, aryl or the like; A is a 1-4C alkylene or allylene] as a recurring unit in the main chain skeleton and (D) inorganic filler, and the content of the component D is >=70 wt.% based on total molding material. Furthermore, it is preferable that a molar ratio (m/n) of formula I and/or formula II is (1/0) to (1/4) and the content of the component C is 0.2-5.0% expressed in terms of phosphorus atom amount based on total amount of compounding component excluding the component D.
申请公布号 JP2000103939(A) 申请公布日期 2000.04.11
申请号 JP19980276344 申请日期 1998.09.30
申请人 HITACHI CHEM CO LTD 发明人 TENDOU KAZUYOSHI;TO HARUAKI;HAGIWARA SHINSUKE
分类号 C08K5/5399;C08G59/68;C08L63/00;C08L85/02;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C08K5/539 主分类号 C08K5/5399
代理机构 代理人
主权项
地址