| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a semiconductor element to be hardly damaged or separated off due to vibrations or shocks by a method, wherein the electrodes of the semiconductor element and the electrodes of a circuit board are connected together through the intermediary of a conductive viscoelastic material that is prescribed in storage elastic modulus and loss elastic modulus. SOLUTION: Bumps 3 are provided to the electrodes 2 of a semiconductor element 1, and a solution of conductive viscoelastic material 4 whose storage elastic modulus G' and a loss elastic modulus G" are 1×102 to 1×107 Pa and 1×102 to 1×107 Pa at a temperature of 25 deg.C respectively is applied to the bumps 3 and then dried out. Then, a semiconductor element 1 is mounted on a circuit board 6 aligning its electrodes 2 with the electrodes 5 of the circuit board 6, and the semiconductor element 1 and the circuit board 6 are bonded together with pressure to serve as a circuit. When the above bonding operation is carried out, a filler 7 is filled into an empty space between the semiconductor element 1 and the circuit board 6 so as not to let air, moisture or the like penetrate into the above empty space. With this setup, vibrations and shocks are relaxed to a semiconductor device, so that a semiconductor element is hardly damaged or peeled due to vibrations or shocks.</p> |
