发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board, allowing certain fitting and holding of a conductor pin without damage of its via hole with a high joining strength, and allowing a high density mounting of the conductor pins. SOLUTION: A head part 11 of a conductor pin 1 having a leg part 13 is press fitted into a via hole 6 of a printed wiring board. The head part 11 is formed with projecting portions 111 projecting from its sidewall and recessed portions 112 recessed from the projecting portions 111 toward a central axis of the via hole 6. An upper opening part of the via hole 6 is blocked with a metal pad 50. The head part 11 of the conductor pin 1 is press fitted into the via hole 6 from a lower opening part side of the via hole 6 so that the projecting portions 111 are fixed to an inner wall of the via hole 6 by caulking. The via hole 6 and the head part 11 of the conductor pin 1 are joined together with solder 2 flowing in gaps 60 formed between the inner wall of the via hole 6 and the recessed portions 112.
申请公布号 JP2000100508(A) 申请公布日期 2000.04.07
申请号 JP19980266231 申请日期 1998.09.21
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA;SATO TOSHIHIRO;ISHIDA NAOTO
分类号 H05K1/18;(IPC1-7):H01R12/32 主分类号 H05K1/18
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