| 摘要 |
PROBLEM TO BE SOLVED: To improve the electrical connection between the metal in a conductive film and an internal conductor and to uniform the adhesion of a plated film to a surface by forming a first and second glass frits with materials one of which melts at the highest temperature in baking and forming the conductive film because of having a softening point lower by a specific temperature value than the highest temperature and the other of which is crystallized at the highest temperature, respectively, and by containing them in a conductive composition at a specific ratio. SOLUTION: A first glass frit contained at 25-90 wt.% with respect to the total of glass frit that is 3-10 wt.% of a solid constituent quantity and is formed along with metal powder of silver, copper or the like has a softening point 100 deg.C lower than the highest temperature in baking for forming a conductive film. This promotes the sintering of the conductive film and diffusive bonding of an internal conductor of a base metal or the like which is easy to oxidize to the metal powder. Because a second glass frit keeps a crystallized state at the highest temperature in baking, it restrains excessive flow and oozing to the surface of the conductive film of the glass. This composition is applied to the outside surface of a laminated ceramic electronic component body or the like, and is advantageous in forming a conductive film.
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