发明名称 |
METHOD FOR CLEANING IC SOCKET |
摘要 |
PROBLEM TO BE SOLVED: To realize a method for cleaning IC sockets capable of reliably cleaning the contact parts of IC sockets used for measuring and evaluating tests by a relatively simple operation. SOLUTION: An IC socket 16 with a contact part 15 to come into contact with a device to be measured is mounted to a dedicated jig 18 to short-circuit the contact part 15 electrically. Then, the contact part 15 is immersed in an electrolyte solution 12 in a cleaning chamber. An electrode 13 connected to a D.C. power source 21 is provided in the electrolyte solution 12 in the above- mentioned cleaning chamber, and a current is passed between the contact part 15 and the electrode 13 in the electrolyte solution 12 to remove solder residues adhered to the contact part 15.
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申请公布号 |
JP2000097992(A) |
申请公布日期 |
2000.04.07 |
申请号 |
JP19980270064 |
申请日期 |
1998.09.24 |
申请人 |
SANTESUTO KK;RINREI TAPE KK;FUJI KASEI KK |
发明人 |
YAMAI ATSUSHI;KAJIKAWA KATSUHIKO |
分类号 |
H01R33/76;G01R31/26;H01L23/32;(IPC1-7):G01R31/26 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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