发明名称 ULTRASONIC THIN FILM THICKNESS MEASURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for measuring the thickness of thin film accurately regardless of the material of thin film to be measured or abrasion on the extremity of a delay material. SOLUTION: A pulse is generated under a state where an ultrasonic sensor 22 comprising a piezoelectric oscillator and a delay material incorporating an ultrasonic wave reflecting face touches a thin film to be measured. Thickness of the film is calculated based on the time required for the ultrasonic wave reflected on the ultrasonic wave reflecting face in the delay material to return back to the piezoelectric oscillator, the composite waveform of the ultrasonic waves reflected on the upper and lower surface of the thin film, the time required for the ultrasonic wave reflected on the extremity of the delaying material to return back to the piezoelectric oscillator after a pulse is generated at a specified temperature recorded in a memory 25, and the ultrasonic waveform returned.
申请公布号 JP2000097683(A) 申请公布日期 2000.04.07
申请号 JP19980287284 申请日期 1998.09.24
申请人 UEDA JAPAN RADIO CO LTD 发明人 OMORI SATOSHI;KOBAYASHI TAKESHI;SHIMIZU KENICHI;TODA SEIJI;YAMAKOSHI TAKAO
分类号 G01B17/02;(IPC1-7):G01B17/02 主分类号 G01B17/02
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