发明名称 CHIP-TYPE STACKED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent the oxidation of the lead part of an internal electrode at the baking of a terminal electrode, by making the main components of the terminal electrode connected to the internal electrode silver/palladium at a specified weight ratio, and adding a specified quantity of boron to it. SOLUTION: An internal electrode 1 consisting of nickel is printed on a ceramic green sheet including barium titanate, and this is stacked. Then, it is cut into each chip, and then paste which has silver/palladium for its main components and to which boron is added is applied, and in nitrogen atmosphere it is baked to form a terminal electrode 7. The weight ratio of the silver/ palladium being the main components of this terminal electrode 7 is made about 7:3 to 3:7, and the quantity of added boron is made about 0.1 pts.wt. to 1.0 pts.wt. to 100 pts.wt. of main components. As a result, the electric property rises by preventing the oxidation of the internal electrode 1 consisting of the terminal electrode 7 and nickel.
申请公布号 JP2000100653(A) 申请公布日期 2000.04.07
申请号 JP19980264515 申请日期 1998.09.18
申请人 TDK CORP 发明人 OCHIAI TOSHIAKI;MARUNO TETSUJI;SASAKI AKIRA;KIKUCHI KAZUHIKO
分类号 H01G4/12;H01C1/142;H01C1/146;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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