发明名称 DEVELOPMENT PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent mist, sprayed out of a high-pressure spray outlet from leakage to the outside of a cup and the humidity outside of the cup, from rising by providing a structure so as to cover the cup from the upper part of the high-pressure spray outlet to the lower part of a wafer stage. SOLUTION: This development processing device 2 has a wafer stage 11 which rotates a wafer W by holding it roughly horizontally, a development cup 12 which covers the wafer W from the peripheral part of the wafer stage 11 to the lower part of it, and a high-pressure spray outlet 16 for spraying mist state pure water on the surface of the wafer W supported on the wafer stage 11. In this case, at the outside of the development cup 12 is provided a cup 31 which covers the wafer W from a high-pressure spray outlet to the lower part of the wafer stage 11 downward and to the peripheral part of the development cup 12 horizontally. An exhaust hole 32 is provided on the sidewalls of the cup 31 for exhausting mist 'm' over the wafer W.
申请公布号 JP2000100702(A) 申请公布日期 2000.04.07
申请号 JP19980269292 申请日期 1998.09.24
申请人 SONY CORP 发明人 KADOTA HISASHI
分类号 H01L21/027;G03F7/30;(IPC1-7):H01L21/027 主分类号 H01L21/027
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